One indispensable element of the development of information technology is the gallium arsenide semiconductor which is used in mobile phones, LDs and LEDs. High-purity metal arsenide is one of the raw materials used in their manufacture. We focused on characteristics early on and we have been mass-producing the world's purest high-purity metal arsenide at 99.999995% (7N5). We are currently the only manufacturer in Japan and we also hold the highest share of the global market.

In recent years, demand for heat-dissipating materials has been growing as electronic devices become increasingly sophisticated, integrated, miniaturized, and thinner. Heat-dissipating materials are essential to prevent abnormal operation of electronic equipment by releasing the heat generated internally to the outsideair. They are used in high-capacity communication devices and equipment, including smartphones and PCs, as well as in inverter devices for railway cars, communication base stations, semiconductor manufacturing equipment, next-generation automobiles (such as hybrid cars and EVs), and the like.
Heat-dissipating ceramics materials include aluminum oxide (Al₂O₃) also known as alumina, aluminum nitride (AIN), and silicon carbide (SiC). In the market, alumina, which is inexpensive, has the largest share, while aluminum nitride (AIN), which is xpensive and highly functional, still has a small share. Features of aluminum nitride (AIN) include high thermal conductivity, insulation (does not conduct electricity), heat uniformity, and corrosion resistance. Accordingly, it is now being used in semiconductor manufacturing equipment, parts, and devices where these features are particularly needed. We expect demand for aluminum nitride ceramics as a heatdissipating material to increase amid the growing performance requirements of 5G and other communication devices, expansion of data centers, and proliferation of power semiconductors and next-generation automobiles, as well as the rising performance requirements of semiconductors, electronic devices, and otherequipment and terminals.

Our Electronics Division has built a production system for molding, sintering, and processing procured aluminum nitride (AIN) raw materials (powder). We also manufacture and sell aluminum nitride ceramics components, substrates, and fillers for use as heat-dissipation materials. Our strength lies in the sintering technology we have accumulated over the years, including with respect to sintering time and temperature adjustment. Our proprietary technologies and know-how enable us to manufacture worldclass large-scale items that are resistant to warping, cracking, and discoloration factors that often arise during the sintering process.
In the domestic ceramics industry, therefore, we are well-known as a contract manufacturer of aluminum nitride ceramics products. In addition, we have a lineup of four grades of sintered aluminum nitride ceramics products (components and substrates) - with thermal conductivities of 90W, 170W, 200W, and 230W - to meet customer needs. In fact, we developed and launched the highest-grade product, with thermal conductivity of 230W, ahead of other companies. Currently, we are developing an even higher-grade sintered material with a thermal conductivity of 250W.
We expect market demand to continue growing. In response, we are increasing our production capacity, having added one sintering furnace. We will continue leveraging our proprietary technologies to offer a range of high-quality products centered on aluminum nitride ceramics.